Super Thermal Grease
Designed for use with heat sinks to effectively
dissipate heat generated by electronic devices
and circuitry. Ideally used to cool CPUs (when
over clocking), chipset and graphics cards.
Formulated with Boron Nitride, this grease
gives super high thermal conductivity without
the capacitance issue associated with silver
filled greases.
Key Features:
•
•
•
•
Thermal conductivity of 3.0 w/(m·k)
Contains no silicone or metal particles
Pigmented with Boron Nitride particles
Maximum operating temperature of 150 °C / 302 °F
It is important to properly cool your system for maximum reliability and to prevent premature failure.
Heat sinks alone are not entirely effective at keeping your system efficiently cooled do to the imperfections on the
surface of your circuitry and the heat sink. See flash demonstration on our website,
http://www.mgchemicals.com/techsupport/860_demo.html
The use of our Super Thermal Grease will assist the heat sink to provide you with superior heat dissipating ability.
Specifications
Typical properties:
Phase:
Base:
Odor:
Color:
Specific Gravity:
Flash point:
Autoignition temp.:
Solubility in water:
VOC:
Vapor Density:
RoHS complaint:
Corrosiveness
Test Method
Highly viscous
Blend of Synthetic Fluids
Odorless
White
1.2 g/L
165
°
C
> 315
°
C
Insoluble
Zero
> 5 (Air =1)
Yes
Non-Corrosive
Thermal Properties
Thermal conductivity
Temperature in
0
C
50
100
150
Thermal limits
Peak
Long term
Electrical Properties
Dielectric Strength
(Tested at 1 MHz @ ambient
condition)
Dielectric Constant
(Tested at 1 MHz)
Dissipation Factor
(Tested at 1 MHz)
Volume Resistivity
(Tested at ambient condition)
ASTM D257
1.2 X 10
12
Ohms·cm
ASTM D150
0.001
ASTM D150
170 Volts/mil
-40
°
C to +150
°
C
-15
°
C to +125
°
C
ASTM D5470
in W/mK
2.97
2.98
3.00
ASTM D150
4.2
Available Sizes
Catalog Number
8615
Sizes Available
3.5 gram (0.12 oz)
Description
Syringe
MEMS传感器
